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#1
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Heat Sink Compound Necessary?
I want to replace the Intel stock fan on my 478 Pentium 4, because I need to overclock heavily. Is heat sink compound needed, recommended? Thank you. Talal Itani |
#2
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Heat Sink Compound Necessary?
Talal Itani wrote:
I want to replace the Intel stock fan on my 478 Pentium 4, because I need to overclock heavily. Is heat sink compound needed, recommended? Thank you. Talal Itani You need a good thermal path from the top of the CPU, into the heatsink. So, yes, thermal compound or a thermal pad should be used. The thermal compound displaces air, and air is a good insulator. Only a thin layer is required, and you don't want to use so much, that major quantities squirt out the side of the joint. Paul |
#3
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Heat Sink Compound Necessary?
You ABSOLUTELY have to use thermal paste or compound, or your CPU will
overheat and fry. -- DaveW ___________ "Talal Itani" wrote in message newsYIWh.4971$Fs6.2976@trnddc03... I want to replace the Intel stock fan on my 478 Pentium 4, because I need to overclock heavily. Is heat sink compound needed, recommended? Thank you. Talal Itani |
#4
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Heat Sink Compound Necessary?
You ABSOLUTELY have to use thermal paste or compound, or your CPU will
overheat and fry. I think that's exaggerating it a little.. their CPU would certainly run hotter than it should, but to the point of destruction ? I have my doubts.. Chris |
#5
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Heat Sink Compound Necessary?
On Sun, 22 Apr 2007 23:18:00 -0400, "Skeleton Man"
wrote: You ABSOLUTELY have to use thermal paste or compound, or your CPU will overheat and fry. I think that's exaggerating it a little.. their CPU would certainly run hotter than it should, but to the point of destruction ? I have my doubts.. Chris It's not absolutely necessary to use thermal compound at all either, (three?) years ago I reported on a test where I took a ridiculous amount of time to lap a heatsink *VERY* flat and had practically identical temps even on a flipchip Athlon XP. Today's heat spreaders aren't as flat as the flipchip cores bare, were, but if they were lapped very well the result should be equally good. However, the main point might be what was written above, "a ridiculous amount of time", when otherwise all one has to do is spend a few seconds applying thermal compound to achieve the same results. Plus, you can't lap a CPU w/o voiding the warranty. |
#6
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Heat Sink Compound Necessary?
Paul wrote:
I want to replace the Intel stock fan on my 478 Pentium 4, because I need to overclock heavily. Is heat sink compound needed, recommended? Thank you. You need a good thermal path from the top of the CPU, into the heatsink. So, yes, thermal compound or a thermal pad should be used. The thermal compound displaces air, and air is a good insulator. Only a thin layer is required, and you don't want to use so much, that major quantities squirt out the side of the joint. Agreed... -- http://www.bootdisk.com/ |
#7
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Heat Sink Compound Necessary?
DaveW wrote: You ABSOLUTELY have to use thermal paste or compound, or your CPU will overheat and fry. How does a Pentium 4, which has built-in thermal protection, fry, unless you apply a torch to it? |
#8
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Heat Sink Compound Necessary?
It's not absolutely necessary to use thermal compound at all
either, (three?) years ago I reported on a test where I took a ridiculous amount of time to lap a heatsink *VERY* flat and had practically identical temps even on a flipchip Athlon XP. Today's heat spreaders aren't as flat as the flipchip cores bare, were, but if they were lapped very well the result should be equally good. Interesting, I've head of lapping the heatsink, but not the cpu. Guess it makes sense to have metal to metal contact rather than metal to plastic coating. What is the coating on them anyway ? some kind of thermal compound or just a protective plastic ? However, the main point might be what was written above, "a ridiculous amount of time", when otherwise all one has to do is spend a few seconds applying thermal compound to achieve the same results. Plus, you can't lap a CPU w/o voiding the warranty. It would be an interesting exercise.. I doubt you could do much (if any) harm to the heatspreader. btw, when a temperature reading talks about cpu case, does that mean the temperature of the heatspreader ? Chris |
#9
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Heat Sink Compound Necessary?
On Mon, 23 Apr 2007 13:35:21 -0400, "Skeleton Man"
wrote: It's not absolutely necessary to use thermal compound at all either, (three?) years ago I reported on a test where I took a ridiculous amount of time to lap a heatsink *VERY* flat and had practically identical temps even on a flipchip Athlon XP. Today's heat spreaders aren't as flat as the flipchip cores bare, were, but if they were lapped very well the result should be equally good. Interesting, I've head of lapping the heatsink, but not the cpu. Guess it makes sense to have metal to metal contact rather than metal to plastic coating. There's minimal lapping necessary on the flipchips, only a slight raised area from the laser product etching on earlier athlon XP / Palomino, none on the latter XPs unless there were some surface irregularity. As for lapping CPUs with heat spreaders, there were people doing it back in the PII/Celeron era too as the Celerons in particular had a heat spreader with the outer border raised a bit higher than the middle. What is the coating on them anyway ? some kind of thermal compound or just a protective plastic ? I don't know what the coating on them is, but immediately below that I though it was just a silicon sheet. However, the main point might be what was written above, "a ridiculous amount of time", when otherwise all one has to do is spend a few seconds applying thermal compound to achieve the same results. Plus, you can't lap a CPU w/o voiding the warranty. It would be an interesting exercise.. I doubt you could do much (if any) harm to the heatspreader. btw, when a temperature reading talks about cpu case, does that mean the temperature of the heatspreader ? It might depend on the context, normally I would think not but that would also depend on the sink interface, IMO die temp is a much better number to use if it's reasonably measurable (motherboard does it). |
#10
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Heat Sink Compound Necessary?
On 23 Apr 2007 09:38:58 -0700, larry moe 'n curly
wrote: DaveW wrote: You ABSOLUTELY have to use thermal paste or compound, or your CPU will overheat and fry. How does a Pentium 4, which has built-in thermal protection, fry, unless you apply a torch to it? It's doubtful it would fry w/o thermal compound, but without any heatsink it can as the die temp rate of increase on some areas can be higher than on others, it's conducted from the area generating heat to the rest of the die, so by the time the thermal shutdown circuit were to respond some areas could already be hot enough to be damaged. |
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