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#1
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pads or grease?
I'm just about to install a retail Athlon XP2500, what I want to know is, is
it worth investing in some form of thermal grease or is the pad that comes with the heatsink ok? Also, have anyone had faulty retail XP2500? I have heard moans that there are a lot of faulty OEM versions out there cheers |
#2
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Pads can be hell to get off later, and grease such as arctic alumina, which
is said to be easy to get off, will run cooler. It's just $4. -- Ed Light Smiley :-/ MS Smiley :-\ |
#3
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AJ wrote:
I'm just about to install a retail Athlon XP2500, what I want to know is, is it worth investing in some form of thermal grease or is the pad that comes with the heatsink ok? Also, have anyone had faulty retail XP2500? I have heard moans that there are a lot of faulty OEM versions out there cheers AMD say that using grease will invalidate your warranty. However it does work better than the pad. Just be careful not to use too much. Take care, John. |
#4
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"Ed Light" wrote in message ... Pads can be hell to get off later, and grease such as arctic alumina, which is said to be easy to get off, will run cooler. It's just $4. If the pad's already on there, after you scrape it off be sure to remove the residue. 99% isopropyl alcohol should do it, but if not, use that to clean off whatever you have to use. Not sure if there are any no-no cleaners. Instructions for arctic alumina are on its web site, http://www.arcticsilver.com -- Ed Light Smiley :-/ MS Smiley :-\ |
#5
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In article , cd5
@pleasenospamfairlight3.com says... I'm just about to install a retail Athlon XP2500, what I want to know is, is it worth investing in some form of thermal grease or is the pad that comes with the heatsink ok? If you don't plan on removing the heatsink any time soon the pad will be fine. Also, have anyone had faulty retail XP2500? I have heard moans that there are a lot of faulty OEM versions out there Mine is fine, and I haven't heard of any such problems. Doug |
#6
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"Mr E" wrote: AMD say that using grease will invalidate your warranty. However it does work better than the pad. Just be careful not to use too much. How does one avoid getting bubbles trapped in the grease between the CPU and the heatsink? *TimDaniels* |
#7
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"Timothy Daniels" wrote How does one avoid getting bubbles trapped in the grease between the CPU and the heatsink? Read the instructions on articsilver.com -- Ed Light Smiley :-/ MS Smiley :-\ |
#8
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"Ed Light" replied: "Timothy Daniels" wrote: How does one avoid getting bubbles trapped in the grease between the CPU and the heatsink? Read the instructions on articsilver.com As detailed as the verbose Product Instructions appear to be, they don't describe how to bring the two mating surfaces together. Has anyone compared the result of bringing the two surfaces together in the following 3 ways: 1) "laid flat", i.e. the entire faces of the two surfaces meet simultaneously, versus 2) "edge first", i.e. the two surfaces are first brought together at the edge of one or both and then laid together, versus 3) "corner first", i.e. the two surfaces are first brought together at a corner of one or both and then laid together? Likening the process to laying ceramic tiles (without the use of a toothed trowel), I'd go for number #2 for being the one that is done most easily and which leaves the least amount of air trapped between the two surfaces. Does anyone have experience with each of these 3 ways? BTW, has anyone seen adverse results from rotating, i.e. "twisting", the two surfaces together while mating them? The admonition due to knocking the "peak" off sounds illogical. *TimDaniels* |
#9
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Thermal compound provides a tiny improvement between a
properly machine heatsink and CPU. In fact, so little thermal compound must be applied that it only spreads in the center half of the CPU. That is where almost all heat transfers to CPU. If thermal compound expands beyond the center half, then too much was used. Thermal compound is only for the microscopic holes between CPU and heatsink. Most of the heatsink makes direct contact with CPU. A direct CPU to heatsink interface is more thermally efficient than one that is CPU to thermal compound to heatsink. Air bubble in thermal compound? If an air bubble exists, then way too much thermal compound was applied. BTW, Arctic Silver is overpriced hype. Most every thermal compound is equivalent to Arctic Silver - but sells at a much lower cost. What is the thermal resistance of Arctic Silver? They don't even provide basic numbers. If they did, then everyone would learn the more expensive Arctic Silver is really not superior to other thermal compounds. Apply heatsink directly to CPU without any thermal compound. Measure CPU temperature. Then repeat same experiment and measurement using a thermal compound. Thermal compound should only result in single digit temperature reduction. If your heatsink CPU combination results in greater temperature decrease, then trash the heatsink as defective. Thermal compound is superior to pads or thermal tapes because most of heatsink makes direct contact to CPU. Thermal compound only decreases thermal resistance by filling microscopic holes and permits most of heatsink to contact CPU. If you applied the so little amount, then all those application methods do nothing. But then Arctic Silver, et al is being applies only to reduce CPU temperatures by single digit degrees. Timothy Daniels wrote: As detailed as the verbose Product Instructions appear to be, they don't describe how to bring the two mating surfaces together. Has anyone compared the result of bringing the two surfaces together in the following 3 ways: 1) "laid flat", i.e. the entire faces of the two surfaces meet simultaneously, versus 2) "edge first", i.e. the two surfaces are first brought together at the edge of one or both and then laid together, versus 3) "corner first", i.e. the two surfaces are first brought together at a corner of one or both and then laid together? Likening the process to laying ceramic tiles (without the use of a toothed trowel), I'd go for number #2 for being the one that is done most easily and which leaves the least amount of air trapped between the two surfaces. Does anyone have experience with each of these 3 ways? BTW, has anyone seen adverse results from rotating, i.e. "twisting", the two surfaces together while mating them? The admonition due to knocking the "peak" off sounds illogical. *TimDaniels* |
#10
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Get the AMD Socket A Cooler Installation Guide
http://www.amd.com/us-en/assets/cont...docs/23986.pdf -- Ed Light Smiley :-/ MS Smiley :-\ |
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