Typical mains power for mid-range PC?

On Fri, 04 Aug 2006 01:53:05 -0400, kony Gave us:


So you feel the existence of one specified parameter makes
any other parameters irrelevant?

Stop making **** up, you retarded little *******.

On Fri, 04 Aug 2006 01:53:05 -0400, kony Gave us:

They can be measured BTW, did you ever bother to do any
testing? We can be sure you either didn't, or don't
understand it. Let's break it down into overly simplified
terms.

**** you, retard boy.

On Fri, 04 Aug 2006 01:53:05 -0400, kony Gave us:

Hypothetical PSU outputting 20A RMS full load with very low,
100mA ripple with a constant load.

Shows how little you know, ****tard. Ripple is not expressed in
amps.

On Fri, 04 Aug 2006 01:53:05 -0400, kony Gave us:

It is not the full, steady load ripple
that mattered, it is easily eclipsed.

Your understanding of electronics has been eclipsed.

That is all.

On Fri, 04 Aug 2006 01:53:05 -0400, kony Gave us:

Seems a bit more likely you know someone or some company
that makes these units if they exist at all.

Seems that you are back to making jack-jawed retarded peanut gallery
comments again.

**** off, boy.

On Fri, 04 Aug 2006 01:53:42 -0400, kony Gave us:

On Thu, 03 Aug 2006 05:23:32 GMT, Phat Bytestard
wrote:

On Wed, 02 Aug 2006 12:51:12 -0400, kony Gave us:

I can see you don't understand, and I'm ok with that

I see that you have resorted to mouthing off.

You can **** off with that dumb ****, dumb****.


LOL, that's mouthing off?

You need a reality check.


Where do you want to meet? I'll check ya, you little punk ****.

On Fri, 04 Aug 2006 02:06:21 -0400, kony Gave us:


There is no heat sink. You are not on the same page here,
we're talking about HDD PCBs.


You lie. The SMD components that drive the spindle motor have heat
sink tabs integrated directly to the die, you stupid ****.

On Fri, 04 Aug 2006 02:06:21 -0400, kony Gave us:


Go ahead and extrapolate it then, surely you will be able to
do this "easy" thing...

You're an idiot.

On Fri, 04 Aug 2006 02:38:56 -0400, kony Gave us:

Known by the fab, yes. Also known by whoever has access to
this data.

You conveniently failed to mention this (more important)
consideration, and yet still allude to someone knowing it,
but not that the data is availabe to the person taking the
reading.


Wrong. The packaging material is declared, and the emissivity for
said material is known, and the cross sectional thickness of the
packaging media before the die is encountered is known.

VERY ****ing straightforward, you clueless *******.

On Fri, 04 Aug 2006 02:38:56 -0400, kony Gave us:

So ultimately we're back to square one, that the additional
effort is not going to achieve what you claimed unless there
was other data already availble, or more importantly,
obtained.

Or even more importantly... already known, and already taken into
account.

You are ****ing lost, and you are not going to achieve escape
velocity from your bull****.