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#131
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jeffc wrote:
"Conor" wrote in message ... Then the heatsink wasn't applied right (at an angle, not just plopped straight down so that it might trap air bubbles), or the heatsink was not clamped with much pressure. There should never be a "huge" gob of compound that is "quite thick". Just got an old IBM desktop in. Its a P166MMX with fanless cooling. Took the hetsink off and there's a big square of thermal compound. You'll find all old P1 IBM desktops were like that.... Sounds like a "pad". Now a pad is *not* going to be squished as thin as paste. Which just goes to show, even if the high pressure from today's heat sinks, and small "footprint" of the CPU core, weren't enough to make the layer as thin as possible, it would still work with a (relatively) thick pad. Also the engineering of the HS mounting arrangement may assume that you are using a pad, and that assumption affects the clamping pressure and fit. You have to be careful when replacing a pad with paste. |
#132
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"Matt" wrote in message ... Sounds like a "pad". Now a pad is *not* going to be squished as thin as paste. Which just goes to show, even if the high pressure from today's heat sinks, and small "footprint" of the CPU core, weren't enough to make the layer as thin as possible, it would still work with a (relatively) thick pad. Also the engineering of the HS mounting arrangement may assume that you are using a pad, and that assumption affects the clamping pressure and fit. You have to be careful when replacing a pad with paste. Yeah, you might be right, and I didn't mean it to come out that way. I meant heat transfer in general would still work. |
#133
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#134
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jeffc wrote:
Well then, you've certainly accomplished a lot here beav. Glad to be of service -- -Luke- If cars had advanced at the same rate as Micr0$oft technology, they'd be flying by now. But who wants a car that crashes 8 times a day? Registered Linux User #345134 |
#135
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"Matt" wrote in message ... jeffc wrote: "Conor" wrote in message ... Then the heatsink wasn't applied right (at an angle, not just plopped straight down so that it might trap air bubbles), or the heatsink was not clamped with much pressure. There should never be a "huge" gob of compound that is "quite thick". Just got an old IBM desktop in. Its a P166MMX with fanless cooling. Took the hetsink off and there's a big square of thermal compound. You'll find all old P1 IBM desktops were like that.... Sounds like a "pad". Now a pad is *not* going to be squished as thin as paste. Which just goes to show, even if the high pressure from today's heat sinks, and small "footprint" of the CPU core, weren't enough to make the layer as thin as possible, it would still work with a (relatively) thick pad. Also the engineering of the HS mounting arrangement may assume that you are using a pad, and that assumption affects the clamping pressure and fit. You have to be careful when replacing a pad with paste. It's also worth taking into account that those older CPUs were producing much less heat flux (wattage) in general and per contact area... so the thermal stress was not as large as more current CPUs. Back then, with simple or no clamping mechanisms, a thermally conductive adhesive was used to bond the HS to the CPU, being a compromise between an adhesive (with high bond strength) and a thermal compound (with high heat conductivity). The reuirements of today are much more demanding. I had a 486DX4-100 with a malfunctioning fan that was spinning half of the time very slowly (bad bearing i guess) and not at all the other half - for more than a year (in a hot climate), no damage to the CPU. I could boot Pentium class CPU with just stock HS, no fan, to POST, BIOS setting, and command prompt, with no lockups. Would you do that with current CPUs ? |
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