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Memory upgrade on Asus Maximus III Formula
I bought 2 4-gig modules of Kingston KVR1066D3n7/4G to go in my Asus
Maximus III Formula motherboard. The memory is on the QVL list and is approved to fill all 4 banks. I tried to add it to the memory already in my computer, more Kingston, and the computer would not post. I removed the old memory and put in the new memory, and it still would not post. I did get to the bios and noticed when I added one stick of the new memory to the existing memory, the system showed less memory, as if adding the new memory knocked out one of the existing memory modules, and did not show the new memory at all. One thing that is very obvious is the appearance of the memory. Both old and new are DDR3, 240 pin, but the new memory is about 1/2 the height. Any help? |
#2
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Memory upgrade on Asus Maximus III Formula
Edward wrote:
I bought 2 4-gig modules of Kingston KVR1066D3n7/4G to go in my Asus Maximus III Formula motherboard. The memory is on the QVL list and is approved to fill all 4 banks. I tried to add it to the memory already in my computer, more Kingston, and the computer would not post. I removed the old memory and put in the new memory, and it still would not post. I did get to the bios and noticed when I added one stick of the new memory to the existing memory, the system showed less memory, as if adding the new memory knocked out one of the existing memory modules, and did not show the new memory at all. One thing that is very obvious is the appearance of the memory. Both old and new are DDR3, 240 pin, but the new memory is about 1/2 the height. Any help? Seeing half the memory, suggests the "one module installation case" was knocking out one channel of your dual channels. Like maybe shorting it out or something. The memory looks pretty ordinary. It's a UDIMM, unbuffered non-ECC. The half-height is possible, as Kingston uses FBGA (fine pitch ball grid array) packaged memory chips that aren't as tall as TSOP packaged parts. That's what makes it possible. The retention slots on the side of the module, appear at the regular height offset. http://www.newegg.com/Product/Produc...82E16820134927 I would verify the module is "bottomed out" properly. When the RAM is installed, not only should you hear a "click" when the tabs close on the ends. But, using a flashlight, you should also see the gold plating on the module contacts, disappear below the baseline of the socket. That indicates you've fully seated it. If you're seeing the glint of a lot of gold, above the socket, then it is not completely inserted. The Kingston I bought (low profile, two sets), required enough insertion pressure, to hurt my fingers. This is caused by the "blunt beveling" on the edge of the module. The PCB is perhaps a bit thicker than a regular module (so the module won't bend and break the BGA solder joints). And it's a bit more difficult to bevel the leading edge and make it easy to insert. That's all I can think of, as for why it hurts to insert it. That's the part I hate. Regular height modules are easier to insert. That's about all I can think of. Kingston is usually pretty well tested, so you would not expect a shorted module bypass capacitor taking out the VDIMM rail or anything. On some brands (generics), sometimes you insert the module and it actually ruins your motherboard electrically. While nobody is perfect, I trust Kingston a fair amount. The only thing I've seen Kingston foul up, is not adhering to their datasheet on one occasion (high density versus low density chips). Kingston makes datasheets for modules like this, and I "hold their toes to the fire", in terms of delivering *exactly* what this shows. You don't ship 8 chip modules, when this datasheet shows 16 chips in the engineering drawing... http://www.valueram.com/datasheets/KVR1066D3N7_4G.pdf And in this case, we see the eng. drawing is for a regular profile module, while you've got a low profile one in your hand. It shows 16 chips, but the silhouette in the drawing, is of a TSOP chip. This makes no difference to electrical operation at all. A TSOP and an FBGA do the same thing electrically ("remember things") :-) Try seating them again. While your motherboard likely has some wild VDIMM adjustments possible, it probably isn't that causing a problem. Paul |
#3
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Memory upgrade on Asus Maximus III Formula
On 6/15/2013 4:26 PM, Paul wrote:
Edward wrote: I bought 2 4-gig modules of Kingston KVR1066D3n7/4G to go in my Asus Maximus III Formula motherboard. The memory is on the QVL list and is approved to fill all 4 banks. I tried to add it to the memory already in my computer, more Kingston, and the computer would not post. I removed the old memory and put in the new memory, and it still would not post. I did get to the bios and noticed when I added one stick of the new memory to the existing memory, the system showed less memory, as if adding the new memory knocked out one of the existing memory modules, and did not show the new memory at all. One thing that is very obvious is the appearance of the memory. Both old and new are DDR3, 240 pin, but the new memory is about 1/2 the height. Any help? Seeing half the memory, suggests the "one module installation case" was knocking out one channel of your dual channels. Like maybe shorting it out or something. The memory looks pretty ordinary. It's a UDIMM, unbuffered non-ECC. The half-height is possible, as Kingston uses FBGA (fine pitch ball grid array) packaged memory chips that aren't as tall as TSOP packaged parts. That's what makes it possible. The retention slots on the side of the module, appear at the regular height offset. http://www.newegg.com/Product/Produc...82E16820134927 I would verify the module is "bottomed out" properly. When the RAM is installed, not only should you hear a "click" when the tabs close on the ends. But, using a flashlight, you should also see the gold plating on the module contacts, disappear below the baseline of the socket. That indicates you've fully seated it. If you're seeing the glint of a lot of gold, above the socket, then it is not completely inserted. The Kingston I bought (low profile, two sets), required enough insertion pressure, to hurt my fingers. This is caused by the "blunt beveling" on the edge of the module. The PCB is perhaps a bit thicker than a regular module (so the module won't bend and break the BGA solder joints). And it's a bit more difficult to bevel the leading edge and make it easy to insert. That's all I can think of, as for why it hurts to insert it. That's the part I hate. Regular height modules are easier to insert. That's about all I can think of. Kingston is usually pretty well tested, so you would not expect a shorted module bypass capacitor taking out the VDIMM rail or anything. On some brands (generics), sometimes you insert the module and it actually ruins your motherboard electrically. While nobody is perfect, I trust Kingston a fair amount. The only thing I've seen Kingston foul up, is not adhering to their datasheet on one occasion (high density versus low density chips). Kingston makes datasheets for modules like this, and I "hold their toes to the fire", in terms of delivering *exactly* what this shows. You don't ship 8 chip modules, when this datasheet shows 16 chips in the engineering drawing... http://www.valueram.com/datasheets/KVR1066D3N7_4G.pdf And in this case, we see the eng. drawing is for a regular profile module, while you've got a low profile one in your hand. It shows 16 chips, but the silhouette in the drawing, is of a TSOP chip. This makes no difference to electrical operation at all. A TSOP and an FBGA do the same thing electrically ("remember things") :-) Try seating them again. While your motherboard likely has some wild VDIMM adjustments possible, it probably isn't that causing a problem. Paul Thanks Paul. That did it. I tried one more time and I guess I did get them seated properly this time. And yes, I did have to press really hard. |
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