So what if thermal compound spreads?

CrackerJack wrote:

What exactly is the problem if too much cpu compound is put on the
core and it gets squashed out onto the surrounding area?

Apart from looking messy, is there any real problem with this?


If you put on so much that the compound squashes out past the edges,
that's too much. It generally won't do any damage, but will be nowhere
near as efficient as if you had used less.


-WD

On Sat, 10 Apr 2004 23:51:38 GMT, Will Dormann
wrote:

CrackerJack wrote:

What exactly is the problem if too much cpu compound is put on the
core and it gets squashed out onto the surrounding area?

Apart from looking messy, is there any real problem with this?


If you put on so much that the compound squashes out past the edges,
that's too much. It generally won't do any damage, but will be nowhere
near as efficient as if you had used less.


Unless you start out with an absolutely horrendous heatsink and don't
apply enough compound (it is practically impossible to apply EXACTLY the
amount needed) it will always squish out to a certain extent. Take off a
heatsink and look at the base, you see the outline of the CPU core due to
the compound squishing out. Even the thinnest layer of compound possible
should squish out a little if the heatsink is properly finished.

You don't say why it's inefficient !
Do you mean wasteful or something else constituting inefficient.
A vague and meaningless answer.


"Will Dormann" wrote in message
...
CrackerJack wrote:

What exactly is the problem if too much cpu compound is put on the
core and it gets squashed out onto the surrounding area?

Apart from looking messy, is there any real problem with this?


If you put on so much that the compound squashes out past the edges,
that's too much. It generally won't do any damage, but will be nowhere
near as efficient as if you had used less.


-WD

"QBall" wrote in message
...
You don't say why it's inefficient !
Do you mean wasteful or something else constituting inefficient.
A vague and meaningless answer.

He means heat transfer will not be as good due to the large gap between the
core and the heatsink (I think large is a good word because much of this is
discuss'd on a "microscopic level"

In article , says...

If the goo squishes out then presumably the layer of goo is no
thicker or thinner than if it didn't squish out?

Wrong.


--
Conor

If you're not on somebody's **** list, you're not doing anything
worthwhile.

Piotr Makley wrote:
"rstlne" wrote:


You don't say why it's inefficient !
Do you mean wasteful or something else constituting
inefficient. A vague and meaningless answer.

He means heat transfer will not be as good due to the large
gap between the core and the heatsink (I think large is a good
word because much of this is discuss'd on a "microscopic
level"



If the goo squishes out then presumably the layer of goo is no
thicker or thinner than if it didn't squish out?

Good answer.

"Piotr Makley" wrote in message
...
"rstlne" wrote:

You don't say why it's inefficient !
Do you mean wasteful or something else constituting
inefficient. A vague and meaningless answer.

He means heat transfer will not be as good due to the large
gap between the core and the heatsink (I think large is a good
word because much of this is discuss'd on a "microscopic
level"


If the goo squishes out then presumably the layer of goo is no
thicker or thinner than if it didn't squish out?

That is correct. If that were not correct, then it would mean that the
"microscopic level" did not in fact cover every little nook and cranny. It
the force of the heatsink being held tightly against the CPU that make the
layer thin, not the amount that you use to begin with. There are only 2
amounts of thermal paste that you can use, from the perspective of the
heatsink/CPU inter-layer: enough, and not enough.

"Conor" wrote in message
...
In article , says...

If the goo squishes out then presumably the layer of goo is no
thicker or thinner than if it didn't squish out?

Wrong.


Not wrong

jeffc wrote:


"Piotr Makley" wrote in message
...
"rstlne" wrote:

You don't say why it's inefficient !
Do you mean wasteful or something else constituting
inefficient. A vague and meaningless answer.

He means heat transfer will not be as good due to the large
gap between the core and the heatsink (I think large is a good
word because much of this is discuss'd on a "microscopic
level"


If the goo squishes out then presumably the layer of goo is no
thicker or thinner than if it didn't squish out?

That is correct. If that were not correct, then it would mean that the
"microscopic level" did not in fact cover every little nook and cranny.
It the force of the heatsink being held tightly against the CPU that make
the
layer thin, not the amount that you use to begin with. There are only 2
amounts of thermal paste that you can use, from the perspective of the
heatsink/CPU inter-layer: enough, and not enough.

Exactly, unless you use conductive HS grease which seems insane IMHO.

--

Stacey