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So what if thermal compound spreads?



 
 
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  #13  
Old April 11th 04, 12:59 PM
rstlne
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"QBall" wrote in message
...
You don't say why it's inefficient !
Do you mean wasteful or something else constituting inefficient.
A vague and meaningless answer.


He means heat transfer will not be as good due to the large gap between the
core and the heatsink (I think large is a good word because much of this is
discuss'd on a "microscopic level"


  #14  
Old April 11th 04, 03:36 PM
Max
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Rob Morley wrote:

Yes as it acts as an insulator. The idea of thermal
compound is to fill the very small scratches on the
faces.

Actually the thermal paste is non-conductive.

Eh?



You thought he meant thermally, we realised he meant
electrically.

I realised he could have meant either, so asked for
elaboration. Actually some thermal compund is electrically
conductive too,



Which one?


so I think it was a dangerous statement to
make.


  #17  
Old April 11th 04, 04:03 PM
Paul Hopwood
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CrackerJack wrote:

What exactly is the problem if too much cpu compound is put on the
core and it gets squashed out onto the surrounding area?


Apart from looking messy, is there any real problem with this?


You'll always get a little but if you are squeezing a lot out it
indicates you've applied far too much, meaning the layer of paste
between the processor die/heatspreader and heatsink is too thick.

Remember, the idea is NOT to form a layer between the two surfaces.
The purpose of the paste is to fill the valleys in the contact
surfaces with something which is more efficient at transferring heat
away from the CPU core than the air which would otherwise fill the
gaps. Even the best thermal material is less efficient than direct
contact between the two metal surfaces.

Also, some thermal materials can be slightly electrically conductive,
so if leaks out and bridges gaps in electrical contacts it is possible
that it will result in reliability problems or even permanent damage
to components.

--
iv Paul iv

 




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