Yousuf Khan wrote:
On 11/13/2018 6:16 PM, Paul wrote:
Looks like one silicon die to me. There are two IP blocks on it.
On the mobile part, there is one IP block (4 cores/8 threads)
"While Ryzen, Threadripper, and EPYC have used the 8-core Zeppelin
building block for their products, the laptop side of the equation
will combine the new high-performance Zen core with the latest Vega
graphics in a single piece of silicon.
Quad-Core with SMT
Vega 10 - 10 CUs (640 SPs)
Die shot of the mobile part, with one CCX on the left, GPU on the right.
The Ryzens use 4-core CCX's, while the Threadrippers use 8-core CCX's.
Here's the Ryzen block diagram:
And that's exactly what my quotes above, provide.
The Ryzen product (APU flavor), uses a new die,
with a 4 core CCX and a GPU. The "IP" (Intellectual Property)
block size is a 4 core CCX, which is getting reused.
In the Zeppelin core, two 4 core CCX IP blocks
are combined on one 8 core die. The 8 core die
is replicated as four dice in an Epyc. This means
they're manufacturing 8 core parts on the silicon
There is a grand total of two die designs.
Ryzen as APU 4 core CCX + GPU on a single die --- A unique
Ryzen desktop two 4 core CCX Zepplin in a single die \
Threadripper two dice of the "Ryzen desktop" persuasion \ The idea
two dummy dice (replaced by working dice \ is to
in the next generation, dice don't have RAM / reuse
connected). / the same
Epyc four dice of the "Ryzen desktop" persuasion / silicon die
So they are required to yield 8 core component parts. To make
some of the more profitable packaged products.
This diagram is an eight core silicon die. The red line, is an
architectural shortcoming, not a "snip point".
The die is one continuous thing.