The difference is that the automotive industry actually test their
prototypes. :-) Consequently the blame lies squarely with Dell and HP for
failing to do proper component integration. It isn't difficult or expensive
to do thermal shock and cycling tests on laptops.

--
"War is the continuation of politics by other means.
It can therefore be said that politics is war without
bloodshed while war is politics with bloodshed."

"Mr.E Solved!" wrote in message
...
So far, every RoHS disadvantage has been demonstrated: cracks,
brittleness, susceptibility to thermal cycling. All we need is some Tin
Whiskers and the worst case scenario has come to pass.

Don't blame RoHS however, as other industries besides the Computer
Manufacturing Industry has used RoHS to advantage, such as the automotive
industry.

I'm guessing TMSC or whatever foundry made these chips simply had bad
materials and/or technique from lack of experience, assuming no malice was
involved, who can say at this point.